Rogers 20mil RO4003C 5 Layer High Frequency PCB with Immersion Gold
(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only)
Introduction
Hello Everyone,
Today, we’re discussing a specialized 5-layer high frequency PCB constructed using Rogers RO4003C.
This 5-layer PCB is fabricated using three cores of RO4003C, with one layer of copper etched away to create 5 layers.
In the stack-up, you can observe that three sheets of 20 mil cores form the fundamental structure. Two layers of dielectric material (prepreg) bond these cores, resulting in a robust 5-layer board. The copper weight for the inner layers is half an ounce, while the outer layers are one ounce. The final thickness of the board measures 2.1mm.
The micro-section image below provides a clearer view of the board's structure. Notably, there is no solder mask applied to the surface, and the pads are plated with immersion gold.
The stack-up of multilayer PCBs can be customized in various ways to meet specific requirements for controlled impedance and signal transmission. The RO4003C family offers an array of core thicknesses, including 8mil, 12mil, 16mil, 20mil, 32mil, and 60mil.
The fixed thickness of the core is crucial for maintaining the electrical length of RF lines on the circuit board.
We offer a diverse selection of high frequency materials, including Rogers 4000 series, 3000 series, 5000 series, and 6000 series, as well as Taconic TLX and TLY series, and the Chinese F4B series.
If you are interested in our products, please feel free to reach out.
Thank you for reading!
Appendix: Our PCB Capability 2024
Factory Process Capability (2024) |
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Substrate Types and Brands |
Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials |
Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic |
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Board Types |
Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB |
CCL Model |
High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A High CTI FR-4: S1600L, ST115 |
Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW; CuClad 217, CuClad 233, CuClad 250. |
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Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30, RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3 |
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Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300; |
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Maximum Delivery Size |
1200mm x 572 mm |
Minimum Finished Board Thickness |
L≤2L: 0.15mm; 4L: 0.4mm |
Maximum Finished Board Thickness |
10.0 mm |
Blind Buried Holes (Non-crossing) |
0.1mm |
Maximum Hole Aspect Ratio |
15:01 |
Minimum Mechanical Drill Hole Diameter |
0.1 mm |
Through-hole Tolerance |
+/- 0.0762 mm |
Press-fit Hole Tolerance |
+/- 0.05mm |
Non-plated Copper Hole Tolerance |
+/- 0.05mm |
Maximum Number of Layers |
32 |
Internal and External Layer Maximum Copper Thickness |
12Oz |
Minimum Drill Hole Tolerance |
+/- 2mil |
Minimum Layer-to-Layer Tolerance |
+/- 3mil |
Minimum Line Width/Spacing |
3mil/3mil |
Minimum BGA Diameter |
8mil |
Impedance Tolerance |
< 50Ω ±5Ω; ≥50Ω±10% |
Surface Treatment Processes |
Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc. |